Liquid Cooling: The Thermal Management Revolution in the Era of AI Computing Power
As AI chip power consumption breaches the kilowatt threshold, traditional air cooling is rapidly approaching its physical limits. Leveraging the exceptional property of liquid, which has a specific heat capacity 3,000 times greater than that of air, liquid cooling technology is reshaping the infrastructure landscape of data centers. Serving as the vital "cooling system" for AI computing power, liquid cooling has evolved from an optional luxury to an absolute necessity.
With the global liquid cooling market surpassing 100 billion RMB in 2026 and projected to reach 300 billion RMB by 2028, the industry is entering its golden age.
Within a liquid cooling system, piping performs the core function of coolant transport and distribution, spanning three major levels: the primary loop from the dry cooler to the CDU (Coolant Distribution Unit), the secondary loop from the CDU to the server rack, and the internal manifold within the rack. Meanwhile, connectors act as the "joints" between the piping and equipment, responsible for rapid connection/disconnection and leak prevention. Together, they form the vital fluid transmission lifeline of the liquid cooling system.